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DG307BDJ-E3 - Vishay

Description: CMOS Analog Switch

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Symbol
DG307BDJ-E3 - Vishay - PCB symbol
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PCB Footprints
DG307BDJ-E3 - Vishay PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 14-PDIP
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3D Models
DG307BDJ-E3 - Vishay - 3D model - Dual-In-Line Packages - 14-PDIP
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DG307BDJ-E3 Details

  • Manufacturer Part Number:

    DG307BDJ-E3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, DIP-14

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDIP-T14

  • JESD-609 Code:

    e3

  • Length:

    18.285 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO/NC

  • Number of Functions:

    2

  • Number of Terminals:

    14

  • Off-state Isolation-Nom:

    62 dB

  • On-state Resistance-Max (Ron):

    50 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.62 mm

DG307BDJ-E3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DG307BDJ-E3 is a standard 1206 package with a pad size of 1.3 mm x 1.3 mm and a spacing of 0.5 mm between pads.
  • To prevent ESD damage, handle the DG307BDJ-E3 with ESD-safe materials, wear an ESD strap, and ensure the assembly area is ESD-protected. Follow standard ESD handling procedures, such as those outlined in ANSI/ESD S20.20.
  • The maximum power dissipation of the DG307BDJ-E3 is 0.5 W. Ensure that the device is operated within this limit to prevent overheating and damage.
  • While the DG307BDJ-E3 is suitable for high-frequency applications, its performance may degrade above 100 MHz. For frequencies above 100 MHz, consider using a more specialized high-frequency diode or consult with a Vishay application engineer.
  • To ensure reliability in high-temperature environments, follow the recommended operating temperature range of -55°C to 150°C, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.

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DG307BDJ-E3 Overview

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