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DG406CWI+T - Analog Devices

Description: Pin-Compatible Plug-In Upgrade for Industry Standard DG406/DG407 ♦ Guaranteed Matching Between Channels, 8Ω (max) ♦ Guaranteed On-Resistance Flatness, 9Ω (max) ♦ Guaranteed Low Charge Injection, 15pC (max) ♦ Low On-Resistance 100Ω (max) ♦ Input Leakage, 5nA (max) at +85°C ♦ Low Power Consumption, 1.25mW (max) ♦ Rail-to-Rail Signal Handling ♦ Digital Input Controls TTL/CMOS Compatible ♦ ESD Protection >2000V per Method 3015.7

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DG406CWI+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - W28+6
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DG406CWI+T - Analog Devices  - 3D model - Small Outline Packages - W28+6
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DG406CWI+T Details

  • Manufacturer Part Number:

    DG406CWI+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    28-SOIC_W-300_MIL

  • Package Description:

    SOP, SOP28,.4

  • Pin Count:

    28

  • Manufacturer Package Code:

    28-SOIC_W-300_MIL

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2000-01-28

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -20 V

  • Neg Supply Voltage-Min (Vsup):

    -4.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Channels:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Off-state Isolation-Nom:

    69 dB

  • On-state Resistance Match-Nom:

    1.5 Ω

  • On-state Resistance-Max (Ron):

    100 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Signal Current-Max:

    0.02 A

  • Supply Current-Max (Isup):

    0.5 mA

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    150 ns

  • Switch-on Time-Max:

    200 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

DG406CWI+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the DG406CWI+T involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. Additionally, it's recommended to place the device near the analog signal sources and keep the analog signal traces away from digital signal traces.
  • To ensure proper powering and decoupling of the DG406CWI+T, use a low-impedance power source, and add decoupling capacitors (e.g., 0.1 μF and 10 μF) between the power pins and ground. Place these capacitors as close to the device as possible to reduce inductance. Additionally, use a 10 kΩ to 100 kΩ resistor in series with the power supply to prevent voltage spikes.
  • The DG406CWI+T can operate up to 100 MHz, but the actual operating frequency depends on the specific application, signal amplitude, and PCB layout. It's recommended to consult the datasheet and perform simulations or testing to determine the maximum operating frequency for a specific design.
  • To handle ESD protection for the DG406CWI+T, use ESD protection devices (e.g., TVS diodes or ESD arrays) on the input and output pins. These devices can absorb ESD events and prevent damage to the DG406CWI+T. Additionally, follow proper handling and storage procedures to minimize the risk of ESD damage.
  • To manage thermal dissipation of the DG406CWI+T, use a heat sink or thermal pad on the exposed pad of the device. Ensure good thermal conductivity between the device and the heat sink or thermal pad. Additionally, consider using a thermal interface material (e.g., thermal tape or thermal grease) to improve heat transfer.

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DG406CWI+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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For a full list of alternate parts for DG406CWI+T, check out Findchips.com