- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for DG418BDY-E3
- Part Number DG418BDY-E3
- Manufacturer Vishay
- Pin Count 8
- Part Category Integrated Circuit
- Package Category Small Outline Packages
- Footprint Name Small Outline Packages - 8-Pin Narrow SOIC
- Released Date Feb 13, 2024
- Last Modified Date Feb 14, 2024 6:25 AM UTC
- Pinout / Pin List Click Here (Member Only)
DG418BDY-E3 Details
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Manufacturer Part Number:
DG418BDY-E3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
SOIC-8
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HTS Code:
8542.39.00.60
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Factory Lead Time:
26 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7.18
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Additional Feature:
ALSO OPERATES WITH 12 V NOMINAL SINGLE SUPPLY
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Analog IC - Other Type:
SPST
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JESD-30 Code:
R-PDSO-G8
DG418BDY-E3 Frequently Asked Questions (FAQs)
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Vishay provides a recommended PCB layout and land pattern in their application note AN81142, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal management and minimize thermal resistance.
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To prevent damage during assembly and soldering, it's recommended to use a soldering iron with a temperature-controlled tip, and to avoid applying excessive force or pressure to the device. Additionally, ensure that the PCB is designed with adequate copper thickness and thermal vias to handle the high current.
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Vishay provides reliability data and lifespan expectations in their datasheet and application notes. The DG418BDY-E3 is designed to meet or exceed industry standards for reliability, with a typical lifespan of 10-15 years or more, depending on operating conditions and environmental factors.
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The DG418BDY-E3 is rated for operation up to 150°C, but it's essential to consider the device's power dissipation and thermal management when operating at high temperatures. Ensure that the PCB is designed with adequate thermal management features, such as thermal vias and heat sinks, to prevent overheating.
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To ensure EMC, follow proper PCB design and layout guidelines, such as separating high-frequency and low-frequency circuits, using shielding and grounding techniques, and minimizing loop areas. Additionally, consider using EMI filters or shielding components in the design.
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DG418BDY-E3 Overview
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