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DG451EY-T1-E3 - Vishay

Description: High Voltage Quad SPST CMOS Analog Switch

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DG451EY-T1-E3 - Vishay PCB footprint - Other - Other - SOIC127P600X175-16N
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DG451EY-T1-E3 Details

  • Manufacturer Part Number:

    DG451EY-T1-E3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, MS-012, SOIC-16

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.38

  • Additional Feature:

    ALSO OPERATES WITH 12V SINGLE SUPPLY AND +/-15V DUAL SUPPLY

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NC

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • On-state Resistance Match-Nom:

    0.13 Ω

  • On-state Resistance-Max (Ron):

    11 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    113 ns

  • Switch-on Time-Max:

    256 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

DG451EY-T1-E3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DG451EY-T1-E3 is a standard SOIC-8 package with a 1.27mm pitch. A minimum pad size of 1.5mm x 1.5mm is recommended for reliable soldering.
  • To ensure reliable switching performance in high-frequency applications, it's essential to minimize parasitic inductance and capacitance. Use short, direct traces, and consider using a ground plane to reduce noise and improve signal integrity.
  • The maximum allowable power dissipation for the DG451EY-T1-E3 is 500mW. Exceeding this limit may cause the device to overheat, leading to reduced performance or even failure.
  • The DG451EY-T1-E3 is rated for operation up to 125°C. However, it's essential to consider the device's power dissipation and thermal management when operating in high-temperature environments to prevent overheating.
  • To protect the DG451EY-T1-E3 from ESD, handle the device with anti-static wrist straps, mats, or bags. Ensure that the PCB and components are properly grounded, and consider adding ESD protection devices, such as TVS diodes, to the circuit.

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DG451EY-T1-E3 Overview

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