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DGD0227S8-13 - Diodes Incorporated

Description: Gate Drivers HV Gate Driver

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DGD0227S8-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - soic-8
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DGD0227S8-13 - Diodes Incorporated  - 3D model - Small Outline Packages - soic-8
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DGD0227S8-13 Details

  • Manufacturer Part Number:

    DGD0227S8-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    8

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Peak Current Limit-Nom:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.1 µs

  • Width:

    3.9 mm

DGD0227S8-13 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the DGD0227S8-13 is -40°C to 125°C.
  • To ensure reliability, follow the recommended derating guidelines for the device, and consider using thermal management techniques such as heat sinks or thermal interfaces to keep the junction temperature within the recommended range.
  • The maximum allowable power dissipation for the DGD0227S8-13 is 1.5W. Exceeding this limit can lead to device failure or reduced lifespan.
  • Yes, the DGD0227S8-13 is suitable for switching applications due to its fast switching times (tr and tf) and low capacitance. However, ensure that the device is properly biased and that the switching frequency is within the recommended range.
  • Follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment. The DGD0227S8-13 has an ESD rating of 2kV human body model (HBM) and 150V machine model (MM).

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DGD0227S8-13 Overview

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