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DGD2101MS8-13 - Diodes Incorporated

Description: High-Side or Low-Side Gate Driver IC Non-Inverting 8-SO

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DGD2101MS8-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
DGD2101MS8-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8 (Type TH)
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3D Models
DGD2101MS8-13 - Diodes Incorporated - 3D model - Small Outline Packages - SO-8 (Type TH)
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DGD2101MS8-13 Details

  • Manufacturer Part Number:

    DGD2101MS8-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    0.6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.22 µs

  • Turn-on Time:

    0.22 µs

  • Width:

    3.9 mm

DGD2101MS8-13 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to the Diodes Incorporated application note for more details.
  • The DGD2101MS8-13 requires a bias voltage of 2.5V to 5.5V. Ensure the input voltage is within this range and the output is properly terminated to prevent oscillations.
  • The DGD2101MS8-13 is designed to operate up to 1.3 GHz. However, the actual operating frequency may vary depending on the specific application and PCB layout.
  • The DGD2101MS8-13 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure the device is stored in an anti-static bag when not in use.
  • Store the DGD2101MS8-13 in a dry, cool place away from direct sunlight. The recommended storage temperature is -40°C to 125°C, and the relative humidity should be below 60%.

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DGD2101MS8-13 Overview

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