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DIT050N06 - Diotec

Description: MOSFET MOSFET, TO-220AB, 60V, 50A, 175C, N

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PCB Footprints
DIT050N06 - Diotec PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB
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3D Models
DIT050N06 - Diotec  - 3D model - Transistor Outline, Vertical - TO-220AB
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DIT050N06 Details

  • Manufacturer Part Number:

    DIT050N06

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2020-01-20

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    5.15

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    245 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    50 A

  • Drain-source On Resistance-Max:

    0.02 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    120 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    85 W

  • Pulsed Drain Current-Max (IDM):

    90 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DIT050N06 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DIT050N06 is a standard SOT223 package with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure proper thermal management, it is recommended to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and to design the PCB with a solid copper plane underneath the device to dissipate heat.
  • The maximum allowed voltage spike on the drain-source pins of the DIT050N06 is 60V for a duration of less than 10ns, according to the datasheet. However, it is recommended to limit voltage spikes to 50V or less to ensure device reliability.
  • Yes, the DIT050N06 can be used in high-frequency switching applications up to 100kHz. However, it is recommended to use a gate driver with a low output impedance and a high current capability to minimize switching losses and ensure reliable operation.
  • To protect the DIT050N06 from ESD, it is recommended to handle the device with an ESD wrist strap or mat, and to use ESD-sensitive packaging and storage materials. Additionally, the device should be soldered onto the PCB using an ESD-safe soldering process.

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DIT050N06 Overview

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