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DLPA2005ERSLT - Texas Instruments

Description: High Current PMIC/LED Driver for DLP2010 DMD and DLP2010NIR (0.2 WVGA) DMD

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PCB Footprints
DLPA2005ERSLT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RSL(S-PVQFN-N48)
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3D Models
DLPA2005ERSLT - Texas Instruments  - 3D model - Quad Flat No-Lead - RSL(S-PVQFN-N48)
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DLPA2005ERSLT Details

  • Manufacturer Part Number:

    DLPA2005ERSLT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    YES

  • Number of Functions:

    1

  • Number of Segments:

    3

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -10 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.24SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    6 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.6 V

  • Supply Voltage1-Max:

    6 V

  • Supply Voltage1-Min:

    2.7 V

  • Supply Voltage1-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

  • fmax-Min:

    36 MHz

DLPA2005ERSLT Frequently Asked Questions (FAQs)

  • TI recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to dissipate heat. A minimum of 1 oz copper thickness is recommended.
  • Ensure good thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature (TJ) and adjust the design accordingly.
  • The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may damage the device.
  • TI recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input lines to protect the device from electrostatic discharge.
  • Power up the device in the following sequence: VCC, then VIN, and finally the input signals. This ensures proper device operation and prevents latch-up.

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DLPA2005ERSLT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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