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DLPA3000DPFDR - Texas Instruments

Description: PMIC/LED Driver for DLP3010 (0.3 720p) DMD

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PCB Footprints
DLPA3000DPFDR - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PFD (S-PQFP-100)
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3D Models
DLPA3000DPFDR - Texas Instruments  - 3D model - Quad Flat Packages - PFD (S-PQFP-100)
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DLPA3000DPFDR Details

  • Manufacturer Part Number:

    DLPA3000DPFDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HTQFP-100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    2

  • Multiplexed Display Capability:

    YES

  • Number of Functions:

    1

  • Number of Segments:

    3

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    70 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    6 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    6 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • fmax-Min:

    40 MHz

DLPA3000DPFDR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency signals away from the power plane and use a low-ESR capacitor for decoupling.
  • Monitor the device's junction temperature (TJ) and ensure it stays within the recommended range (–40°C to 125°C). Also, maintain the recommended voltage and current ratings.
  • Use a heat sink with a thermal interface material (TIM) and ensure good airflow around the device. The heat sink should be designed to keep the junction temperature (TJ) below 125°C.
  • Use a low-dropout regulator (LDO) or a switching regulator with a low output voltage ripple (< 10 mV) to minimize noise and ensure a stable power supply.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and ensure good grounding and shielding of cables and connectors.

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DLPA3000DPFDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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