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DLPC230STZDQQ1 - Texas Instruments

Description: Display Drivers & Controllers DLP® automotive functional safety DMD controller for DLP553x-Q1 chipset 324-BGA -40 to 105

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DLPC230STZDQQ1 - Texas Instruments PCB footprint - BGA - BGA - 324_bga-1
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DLPC230STZDQQ1 - Texas Instruments  - 3D model - BGA - 324_bga-1
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DLPC230STZDQQ1 Details

  • Manufacturer Part Number:

    DLPC230STZDQQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A001.a.3

  • HTS Code:

    8542.31.00.30

  • Date Of Intro:

    2020-09-07

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bit Size:

    24

  • Bus Compatibility:

    I2C, SPI

  • Clock Frequency-Max:

    110 MHz

  • JESD-30 Code:

    S-PBGA-B324

  • Length:

    23 mm

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA324,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.352 mm

  • Supply Current-Max:

    390.7 mA

  • Supply Voltage-Max:

    1.155 V

  • Supply Voltage-Min:

    1.045 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    DISPLAY CONTROLLER, DLP

DLPC230STZDQQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management guide in the 'DLPC230STZDQQ1 PCB Layout and Thermal Management' application note (SLVAE66). It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • The DLPC230STZDQQ1 is highly configurable, and the configuration process involves setting up the device's registers and programming the FPGA. Texas Instruments provides a detailed configuration guide in the 'DLPC230STZDQQ1 Configuration and Programming Guide' (SLAU622). Additionally, the 'DLPC230STZDQQ1 API and Software Development Kit' (SDK) provides a set of APIs and examples to help with configuration and programming.
  • The DLPC230STZDQQ1 has an operating temperature range of -40°C to 85°C (industrial grade) and -40°C to 105°C (extended temperature range). However, it's essential to ensure proper thermal management and heat dissipation to maintain reliability and performance within the specified temperature range.
  • While the DLPC230STZDQQ1 is designed to work seamlessly with TI processors and FPGAs, it's possible to use it with non-TI processors or FPGAs. However, this may require additional development and customization, and Texas Instruments may not provide direct support for such configurations.
  • The power consumption of the DLPC230STZDQQ1 varies depending on the operating mode, clock frequency, and other factors. The typical power consumption is around 1.5W. To optimize power consumption, refer to the 'DLPC230STZDQQ1 Power Management' section in the datasheet and the 'DLPC230STZDQQ1 Power Optimization' application note (SLVAE67).

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DLPC230STZDQQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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