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DLPC3433CZVB - Texas Instruments

Description: DLP® Display Controller for DLP3010 (0.3 720p) DMD

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PCB Footprints
DLPC3433CZVB - Texas Instruments PCB footprint - BGA - BGA - ZVB(S-PBGA-N176)
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3D Models
DLPC3433CZVB - Texas Instruments  - 3D model - BGA - ZVB(S-PBGA-N176)
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DLPC3433CZVB Details

  • Manufacturer Part Number:

    DLPC3433CZVB

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bit Size:

    24

  • Bus Compatibility:

    I2C, SPI

  • Clock Frequency-Max:

    24.002 MHz

  • Display Configuration:

    1280 X 720 PIXELS

  • External Data Bus Width:

    24

  • JESD-30 Code:

    S-PBGA-B176

  • JESD-609 Code:

    e1

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    176

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    NFBGA

  • Package Equivalence Code:

    BGA176,15X15,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    362 mA

  • Supply Voltage-Max:

    1.155 V

  • Supply Voltage-Min:

    1.045 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    DISPLAY CONTROLLER, DLP

DLPC3433CZVB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management guidelines in the DLPC3433CZVB Evaluation Module User's Guide (SLAU575). It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • TI provides a DLPC3433CZVB Performance Optimization Guide (SLAU576) that offers guidelines for optimizing the device's performance, including settings for various display modes, clock frequencies, and power management.
  • The DLPC3433CZVB requires a specific power sequencing and voltage supply configuration. Refer to the device's datasheet and the Power Management Guide (SLAU577) for detailed information on power supply requirements and sequencing.
  • The DLPC3433CZVB has built-in diagnostic and test features, such as the Built-In Self-Test (BIST) and the Diagnostic Interface. Refer to the device's datasheet and the Diagnostic and Test Guide (SLAU578) for information on how to implement and optimize these features.
  • To minimize electromagnetic interference (EMI) and radio-frequency interference (RFI), follow the guidelines outlined in the Electromagnetic Compatibility (EMC) Guide (SLAU579) and the PCB layout recommendations in the DLPC3433CZVB Evaluation Module User's Guide (SLAU575).

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DLPC3433CZVB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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