DM355SZCEA135 - Texas Instruments

DM355SZCEA135 Details

• Manufacturer Part Number:

  DM355SZCEA135

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337

• Pin Count:

  337

• HTS Code:

  8542.31.00.30

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Bit Size:

  32

• Format:

  FIXED POINT

• JESD-30 Code:

  S-PBGA-B337

• JESD-609 Code:

  e1

• Length:

  13 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  337

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA337,19X19,25

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (words):

  32768

• Seated Height-Max:

  1.3 mm

• Supply Voltage-Max:

  1.365 V

• Supply Voltage-Min:

  1.235 V

• Supply Voltage-Nom:

  1.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  13 mm

• uPs/uCs/Peripheral ICs Type:

  Digital Media SoC