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DM3725CBPA - Texas Instruments

Description: IC DGTL MEDIA PROCESSOR 515FCBGA

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DM3725CBPA Details

  • Manufacturer Part Number:

    DM3725CBPA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    515

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.50

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    54 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B515

  • JESD-609 Code:

    e1

  • Length:

    12 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    128

  • Number of Terminals:

    515

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA515,28X28,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    16384

  • Seated Height-Max:

    0.71 mm

  • Speed:

    800 MHz

  • Supply Current-Max:

    1400 mA

  • Supply Voltage-Max:

    1.2 V

  • Supply Voltage-Min:

    1.08 V

  • Supply Voltage-Nom:

    1.14 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

DM3725CBPA Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the core voltage (VDD_CORE) first, followed by the I/O voltage (VDD_IO). This ensures that the internal voltage regulators are properly enabled.
  • To optimize the DDR2 memory interface, ensure that the memory clock frequency is set to 133 MHz or lower, and use a memory module with a CAS latency of 3 or lower. Additionally, adjust the memory timing parameters, such as tRAS, tRCD, and tRP, to optimize performance.
  • The maximum operating temperature range for the DM3725CBPA is -40°C to 85°C. However, it's recommended to operate the device within a temperature range of 0°C to 70°C for optimal performance and reliability.
  • To configure the EMIF for NAND flash memory, set the EMIF mode to asynchronous mode, and configure the NAND flash timing parameters, such as the clock frequency, read latency, and write latency, according to the NAND flash memory datasheet.
  • The recommended method for debugging the DM3725CBPA is to use the XDS560v2 emulator, which provides real-time debugging capabilities and allows for debugging of the ARM Cortex-A8 processor and other peripherals.

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DM3725CBPA Overview

Use the download button to access the DM3725CBPA 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like DM372, or try a keyword search, such as Microprocessors

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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