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DM385AAAR01 - Texas Instruments

Description: DaVinci Digital Media Processor

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PCB Footprints
DM385AAAR01 - Texas Instruments PCB footprint - BGA - BGA - AAR0609A
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3D Models
DM385AAAR01 - Texas Instruments  - 3D model - BGA - AAR0609A
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DM385AAAR01 Details

  • Manufacturer Part Number:

    DM385AAAR01

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Address Bus Width:

    28

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    30 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B609

  • JESD-609 Code:

    e1

  • Length:

    16 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    609

  • Operating Temperature-Max:

    95 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA609,31X31,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    8192

  • Seated Height-Max:

    1.32 mm

  • Speed:

    720 MHz

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    16 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

DM385AAAR01 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Texas Instruments' recommended PCB layout guidelines, including using a 4-layer PCB with a solid ground plane, and placing thermal vias under the device to dissipate heat. Additionally, ensure good airflow around the device and consider using a heat sink if necessary.
  • To optimize the POR circuit, ensure the power supply voltage rises monotonically and reaches the recommended voltage level within the specified time. Use a high-quality capacitor with low ESR and a suitable resistor value to ensure a stable POR signal. Also, consider adding a voltage supervisor IC for additional protection.
  • To reduce EMI, use a multi-layer PCB with a solid ground plane, and ensure good signal integrity by using differential signaling and shielding. Keep high-frequency signals away from sensitive analog circuits, and use EMI filters or common-mode chokes as needed. Additionally, consider using a metal shield or enclosure to contain EMI radiation.
  • To ensure reliable I2C communication, use a pull-up resistor on the SCL and SDA lines, and ensure the clock frequency is within the recommended range. Use a buffer or repeater if the bus is long or has multiple devices. Also, consider using a I2C bus analyzer tool to debug and optimize the communication.
  • When using the device in a high-temperature environment, ensure the PCB is designed to withstand the increased temperatures, and consider using thermal interface materials to improve heat dissipation. Also, consult the device's datasheet for temperature-related specifications and derating factors to ensure reliable operation.

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DM385AAAR01 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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