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DMC2004LPK-7 - Diodes Incorporated

Description: Mosfet N/P-CH Array 20V 750mA, 600mA 500mW Surface Mount DFN1612-6750 mA, 600 mA

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DMC2004LPK-7 - Diodes Incorporated PCB footprint - Other - Other - DMC2004LPK-7
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DMC2004LPK-7 - Diodes Incorporated  - 3D model - Other - DMC2004LPK-7
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DMC2004LPK-7 Details

  • Manufacturer Part Number:

    DMC2004LPK-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    GREEN, ULTRA SMALL, PLASTIC, DFN1612, 6 PIN

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.75 A

  • Drain-source On Resistance-Max:

    0.55 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    20 pF

  • JESD-30 Code:

    R-PBCC-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMC2004LPK-7 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure the device is properly biased, make sure to follow the recommended operating conditions and biasing schemes outlined in the datasheet. This typically includes setting the input voltage, output voltage, and bias resistors correctly.
  • To prevent ESD damage, handle the device in an ESD-controlled environment, wear an ESD strap, and use ESD-safe packaging and materials. Avoid touching the device's pins or exposed pads, and use an anti-static wrist strap or mat when handling the device.
  • The DMC2004LPK-7 is rated for operation up to 125°C. However, it's essential to consider the device's power dissipation, thermal resistance, and junction temperature when operating in high-temperature environments. Ensure the device is properly heatsinked and follow the recommended thermal management guidelines.
  • To troubleshoot issues with the device, start by reviewing the datasheet and application notes to ensure correct usage. Check the device's operating conditions, biasing, and PCB layout. Use oscilloscopes or logic analyzers to debug the issue, and consult with Diodes Incorporated's technical support team if necessary.

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DMC2004LPK-7 Overview

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