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DMC201010R - Panasonic

Description: DMC201010R, Dual Dual Bipolar Transistor, NPN 100 mA 50 V HFE:210 150 MHz Power, 5-Pin Mini5 G3 B

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PCB Footprints
DMC201010R - Panasonic PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - Mini5-G3-B
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3D Models
DMC201010R - Panasonic  - 3D model - SOT23 (5-Pin) - Mini5-G3-B
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DMC201010R Details

  • Manufacturer Part Number:

    DMC201010R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, MINI5-G3-B, MO-178, SC-74A, 5 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Panasonic Electronic Components

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    COMMON EMITTER, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    210

  • JEDEC-95 Code:

    MO-178AA

  • JESD-30 Code:

    R-PDSO-G5

  • Number of Elements:

    2

  • Number of Terminals:

    5

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    150 MHz

DMC201010R Frequently Asked Questions (FAQs)

  • The recommended land pattern for the DMC201010R is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conductivity between the component and the PCB by using a thermal via or a thermal pad. Also, consider using a thermal interface material (TIM) to improve heat transfer. Keep the component away from heat sources and ensure good airflow around the component.
  • The maximum operating temperature range for the DMC201010R is -40°C to 125°C. However, the component's performance may degrade at extreme temperatures, so it's essential to consider the application's temperature requirements.
  • To ensure reliability in high-vibration environments, use a robust PCB design with a secure component mounting method, such as a screw or adhesive. Also, consider using a vibration-dampening material or a shock-absorbing mounting system to reduce the impact of vibrations on the component.
  • Store the DMC201010R in a dry, cool place, away from direct sunlight and moisture. Handle the component by the body, avoiding touching the leads or electrical contacts. Use anti-static packaging and handling materials to prevent electrostatic discharge (ESD) damage.

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DMC201010R Overview

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