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DMC2400UV-13 - Diodes Incorporated

Description: MOSFET N & P Channel 20V 1.03A,700mA 900mV @ 250uA 480mΩ @ 200mA,5V SOT-563-6 RoHS

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PCB Footprints
DMC2400UV-13 - Diodes Incorporated PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT563
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3D Models
DMC2400UV-13 - Diodes Incorporated  - 3D model - SOT23 (6-Pin) - SOT563
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DMC2400UV-13 Details

  • Manufacturer Part Number:

    DMC2400UV-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-563, 6 PIN

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    1.03 A

  • Drain-source On Resistance-Max:

    0.7 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    4.9 pF

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMC2400UV-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for the DMC2400UV-13 should include a solid ground plane, wide power traces, and a thermal relief pattern under the device. This helps to reduce thermal resistance and ensures efficient heat dissipation.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider derating the device's power handling capabilities. Additionally, ensure that the PCB is designed to withstand high temperatures and that all components are rated for the expected operating temperature range.
  • The DMC2400UV-13 has built-in ESD protection, but it's still important to follow proper handling and assembly procedures to prevent ESD damage. Use ESD-safe materials, handle the device by the body or pins, and avoid touching the pins or die. During assembly, use an ESD wrist strap or mat, and ensure that the PCB is properly grounded.
  • Yes, the DMC2400UV-13 is suitable for high-frequency switching applications. However, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the PCB layout is optimized for high-frequency operation. Additionally, consider the impact of parasitic inductance and capacitance on the device's performance.
  • The optimal gate resistor value depends on the specific application requirements, such as switching frequency, voltage, and current. A good starting point is to use the recommended value from the datasheet, and then adjust based on the application's specific needs. Consider factors such as switching speed, power loss, and ringing to determine the optimal value.

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DMC2400UV-13 Overview

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