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DMC3025LSDQ-13 - Diodes Incorporated

Description: MOSFET MOSFET BVDSS: 25V-30V

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DMC3025LSDQ-13 - Diodes Incorporated - PCB symbol
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DMC3025LSDQ-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - DMC3025LSDQ-13
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DMC3025LSDQ-13 - Diodes Incorporated - 3D model - Small Outline Packages - DMC3025LSDQ-13
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DMC3025LSDQ-13 Details

  • Manufacturer Part Number:

    DMC3025LSDQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    10 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    5.3 A

  • Drain-source On Resistance-Max:

    0.02 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    57 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Pulsed Drain Current-Max (IDM):

    60 A

  • Reference Standard:

    AEC-Q101; MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMC3025LSDQ-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMC3025LSDQ-13 is a 3x3mm QFN package with a 0.5mm pitch. The datasheet provides a recommended land pattern and solder mask layout.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended operating temperature range (-40°C to 125°C), and that the PCB is designed to minimize thermal resistance. Additionally, consider using thermal vias and thermal pads to improve heat dissipation.
  • The maximum allowable voltage on the input pins of the DMC3025LSDQ-13 is 5.5V. Exceeding this voltage may cause damage to the device.
  • The DMC3025LSDQ-13 has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • The recommended power-up sequence for the DMC3025LSDQ-13 is to apply the power supply voltage (VCC) before applying the input signals. This ensures that the device is properly initialized and configured before operation.

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DMC3025LSDQ-13 Overview

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