A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation. A thermal pad on the bottom of the device should be connected to a solid ground plane or a thermal relief pattern.
The device requires a stable input voltage (VIN) between 4.5V to 18V. Ensure the input capacitor (CIN) is placed close to the device and has a low ESR. The output voltage (VOUT) should be decoupled with a capacitor (COUT) with a value between 10uF to 22uF.
The maximum allowable ripple voltage on the input (VIN) is 200mVpp, and on the output (VOUT) is 50mVpp. Exceeding these values may affect the device's performance and stability.
Implement overcurrent protection (OCP) using a sense resistor and a comparator. For overheating protection, use a thermal shutdown circuit that monitors the device's junction temperature (TJ) and disables the device when TJ exceeds 150°C.
Use X5R or X7R ceramic capacitors for CIN and COUT. A 10uF to 22uF capacitor value is recommended for CIN, and a 10uF to 47uF capacitor value is recommended for COUT.
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DMG4822SSD-13 Overview
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