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DMG8822UTS-13 - Diodes Incorporated

Description: Mosfet Array 20V 4.9A (Ta) 870mW Surface Mount 8-TSSOP

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DMG8822UTS-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-8L
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DMG8822UTS-13 - Diodes Incorporated  - 3D model - Small Outline Packages - TSSOP-8L
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DMG8822UTS-13 Details

  • Manufacturer Part Number:

    DMG8822UTS-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    GREEN, PLASTIC, TSSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    4.9 A

  • Drain-source On Resistance-Max:

    0.025 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.87 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMG8822UTS-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for the DMG8822UTS-13 should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A 4-layer PCB with a dedicated thermal layer is recommended.
  • To ensure proper biasing, connect the input voltage (VIN) to a stable voltage source, and decouple it with a 10uF capacitor to ground. The enable pin (EN) should be tied to VIN or a voltage divider to set the desired output voltage.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10uF to 22uF is recommended for the input capacitor (CIN). This helps to filter out noise and ensure stable operation.
  • Implement overcurrent protection (OCP) using a sense resistor and a comparator to detect excessive current. Also, consider adding thermal protection using a thermistor or a thermal shutdown circuit to prevent overheating.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10uF to 22uF is recommended for the output capacitor (COUT). This helps to filter out noise and ensure stable output voltage.

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DMG8822UTS-13 Overview

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