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DMHC10H170SFJ-13 - Diodes Incorporated

Description: Mosfet Array 100V 2.9A, 2.3A 2.1W Surface Mount V-DFN5045-12

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DMHC10H170SFJ-13 - Diodes Incorporated PCB footprint - Other - Other - V-DFN5045-12_2024-6
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DMHC10H170SFJ-13 - Diodes Incorporated  - 3D model - Other - V-DFN5045-12_2024-6
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DMHC10H170SFJ-13 Details

  • Manufacturer Part Number:

    DMHC10H170SFJ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    V-DFN5045-12, 12 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    DRAIN

  • Configuration:

    2 BANKS, COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    2.9 A

  • Drain-source On Resistance-Max:

    0.3 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N12

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    12

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    2.1 W

  • Pulsed Drain Current-Max (IDM):

    13 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMHC10H170SFJ-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMHC10H170SFJ-13 is a standard SOT23-6 package with a 1.8mm x 1.35mm body size. The datasheet provides a recommended land pattern and soldering guidelines.
  • To ensure proper soldering, follow the recommended soldering temperature profile and use a solder with a melting point between 217°C to 227°C. Also, ensure the PCB is clean and free of oxidation.
  • The DMHC10H170SFJ-13 has an operating temperature range of -40°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range.
  • Yes, the DMHC10H170SFJ-13 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions and design guidelines to ensure the device meets the required reliability standards.
  • To prevent electrostatic discharge (ESD) damage, handle the DMHC10H170SFJ-13 with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Also, avoid touching the device's pins or handling it in a way that could generate static electricity.

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DMHC10H170SFJ-13 Overview

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