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DMHC3025LSDQ-13 - Diodes Incorporated

Description: Mosfet Array 30V 6A, 4.2A 1.5W (Ta) Surface Mount 8-SO

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DMHC3025LSDQ-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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DMHC3025LSDQ-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8
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DMHC3025LSDQ-13 Details

  • Manufacturer Part Number:

    DMHC3025LSDQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    4.6 A

  • Drain-source On Resistance-Max:

    0.025 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    58 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Pulsed Drain Current-Max (IDM):

    60 A

  • Reference Standard:

    AEC-Q101; MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMHC3025LSDQ-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMHC3025LSDQ-13 is a 3x3mm QFN package with a 0.5mm pitch. The datasheet provides a recommended land pattern and solder mask layout.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal vias, and ensuring good airflow around the device.
  • The maximum allowable voltage on the input pins of the DMHC3025LSDQ-13 is 5.5V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • Yes, the DMHC3025LSDQ-13 is compatible with 3.3V systems. The device is specified to operate from 2.3V to 5.5V, making it suitable for use in 3.3V systems.
  • The DMHC3025LSDQ-13 has built-in ESD protection, but it is still recommended to follow proper ESD handling and storage procedures to prevent damage to the device.

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DMHC3025LSDQ-13 Overview

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