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DMHC4035LSDQ-13 - Diodes Incorporated

Description: Mosfet Array 40V 4.5A (Ta), 3.7A (Ta) 1.5W (Ta) Surface Mount 8-SOIC

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DMHC4035LSDQ-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
DMHC4035LSDQ-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8 height 1.7
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3D Models
DMHC4035LSDQ-13 - Diodes Incorporated - 3D model - Small Outline Packages - SO-8 height 1.7
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DMHC4035LSDQ-13 Details

  • Manufacturer Part Number:

    DMHC4035LSDQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    4 A

  • Drain-source On Resistance-Max:

    0.045 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    38.7 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Pulsed Drain Current-Max (IDM):

    25 A

  • Reference Standard:

    AEC-Q101; MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMHC4035LSDQ-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for DMHC4035LSDQ-13 is a QFN4040-24 package with a 4x4mm body size and 0.5mm pitch. The datasheet provides a recommended land pattern and solder mask design guidelines.
  • To ensure reliable operation of DMHC4035LSDQ-13 in high-temperature environments, follow the recommended operating conditions and thermal management guidelines in the datasheet. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or heat sinks if necessary.
  • The maximum allowable voltage on the input pins of DMHC4035LSDQ-13 is 5.5V. Exceeding this voltage may cause damage to the device or affect its reliability.
  • Yes, DMHC4035LSDQ-13 is compatible with 3.3V systems. The device is specified to operate from 2.3V to 5.5V, making it suitable for use in 3.3V systems.
  • To handle ESD protection for DMHC4035LSDQ-13, follow proper ESD handling procedures during device handling and assembly. The device has built-in ESD protection, but it is still important to follow proper ESD precautions to prevent damage.

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DMHC4035LSDQ-13 Overview

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