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DML3008LFDS-7 - Diodes Incorporated

Description: Power Switch/Driver 1:1 N-Channel V-DFN2020-8 (Type N)

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DML3008LFDS-7 - Diodes Incorporated PCB footprint - Other - Other - DML3008LFDS-7-1
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DML3008LFDS-7 - Diodes Incorporated  - 3D model - Other - DML3008LFDS-7-1
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DML3008LFDS-7 Details

  • Manufacturer Part Number:

    DML3008LFDS-7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    V-DFN-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    Load switch

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.85 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.55V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

DML3008LFDS-7 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DML3008LFDS-7 is a 2x2 array of 0.5mm pitch pads, with a minimum pad size of 0.3mm x 0.3mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
  • To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C. Apply a small amount of solder paste to the PCB pads, and then place the DML3008LFDS-7 on top. Use a reflow oven or a hot air gun to melt the solder paste, and ensure the component is properly aligned during the soldering process.
  • The maximum operating temperature range for the DML3008LFDS-7 is -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • The DML3008LFDS-7 is not designed for use in high-humidity environments. It's recommended to use the device in environments with a relative humidity of 60% or less to prevent moisture-related issues.
  • The recommended storage condition for the DML3008LFDS-7 is in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid storing the device in direct sunlight or near heat sources.

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DML3008LFDS-7 Overview

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