DMN10H220LPDW-13 footprint, schematic symbol and 3D model by Diodes Incorporated

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PCB Footprints

DMN10H220LPDW-13 - Diodes Incorporated PCB footprint - Other - Other - PowerDI5060-8 (SWP) (Type R)-13-3

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Datasheet Download Datasheet
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Part Number DMN10H220LPDW-13
Manufacturer Diodes Incorporated
Pin Count 12
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - PowerDI5060-8 (SWP) (Type R)-13-3
Released Date Dec 7, 2021
Last Modified Date Apr 4, 2024 4:57 PM UTC
Pinout / Pin List Click Here (Member Only)

DMN10H220LPDW-13 Details

Manufacturer Part Number:
DMN10H220LPDW-13
Rohs Code:
Yes
Part Life Cycle Code:
Active
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
12 Weeks
Manufacturer:
Diodes Incorporated
YTEOL:
6
Avalanche Energy Rating (Eas):
1.1 mJ
Case Connection:
DRAIN
Configuration:
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
100 V
Drain Current-Max (ID):
8 A
Drain-source On Resistance-Max:
0.222 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
17 pF
JESD-30 Code:
R-PDSO-F8
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
2
Number of Terminals:
8
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
2.2 W
Pulsed Drain Current-Max (IDM):
32 A
Reference Standard:
MIL-STD-202
Surface Mount:
YES
Terminal Finish:
MATTE TIN
Terminal Form:
FLAT
Terminal Position:
DUAL
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

DMN10H220LPDW-13 Frequently Asked Questions (FAQs)

The recommended PCB footprint for DMN10H220LPDW-13 is a standard SOD-123 package footprint with a minimum pad size of 1.3mm x 1.3mm and a maximum pad size of 1.5mm x 1.5mm.
While the DMN10H220LPDW-13 is rated for operation up to 150°C, it's recommended to derate the power dissipation at higher temperatures to ensure reliability. Consult the datasheet for thermal impedance and power derating curves.
Follow the recommended soldering profile for the SOD-123 package, with a peak temperature of 260°C and a soldering time of 3-5 seconds. Ensure the PCB is clean and free of oxidation, and use a solder with a melting point above 217°C.
The DMN10H220LPDW-13 has an ESD rating of 2kV per Human Body Model (HBM) and 150V per Machine Model (MM). Take proper ESD precautions during handling and assembly to prevent damage.
Yes, the DMN10H220LPDW-13 is suitable for switching regulator applications due to its low RDS(on) and high current capability. However, ensure the device is properly driven and the PCB is designed to minimize parasitic inductance and capacitance.

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DMN10H220LPDW-13 Overview

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