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DMN2011UTS-13 - Diodes Incorporated

Description: MOSFET MOSFET BVDSS: 8V-24V

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DMN2011UTS-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-8
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DMN2011UTS-13 - Diodes Incorporated  - 3D model - Small Outline Packages - TSSOP-8
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DMN2011UTS-13 Details

  • Manufacturer Part Number:

    DMN2011UTS-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    17 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    9 A

  • Drain-source On Resistance-Max:

    0.013 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    265 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.3 W

  • Pulsed Drain Current-Max (IDM):

    70 A

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN2011UTS-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMN2011UTS-13 is a 1.6mm x 1.6mm pad with a 0.5mm x 0.5mm thermal pad in the center, and a 0.3mm x 0.3mm pad for the gate pin.
  • To ensure proper thermal management, a thermal pad or heat sink should be attached to the drain pin, and the device should be mounted on a PCB with a thermal via or a heat sink attached to the thermal pad.
  • The maximum allowed voltage on the gate pin is ±20V, but it's recommended to keep it within ±15V to ensure reliable operation and prevent damage to the device.
  • Yes, the DMN2011UTS-13 is suitable for high-frequency switching applications up to 100kHz, but the user should ensure that the PCB layout and component selection are optimized for high-frequency operation.
  • To protect the DMN2011UTS-13 from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the PCB has ESD protection components, such as TVS diodes or ESD protection arrays, near the device.

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DMN2011UTS-13 Overview

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