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DMN2050LFDB-13 - Diodes Incorporated

Description: Mosfet Array 20V 3.3A 730mW Surface Mount U-DFN2020-6 (Type B)

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PCB Footprints
DMN2050LFDB-13 - Diodes Incorporated PCB footprint - Other - Other - U-DFN2020-6 (Type B)_2025-2
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3D Models
DMN2050LFDB-13 - Diodes Incorporated  - 3D model - Other - U-DFN2020-6 (Type B)_2025-2
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DMN2050LFDB-13 Details

  • Manufacturer Part Number:

    DMN2050LFDB-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    U-DFN2020-6, 6 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    4.5 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3.3 A

  • Drain-source On Resistance-Max:

    0.045 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    63 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.42 W

  • Pulsed Drain Current-Max (IDM):

    25 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN2050LFDB-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMN2050LFDB-13 is a standard SOT23 package footprint with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure proper biasing, connect the input pin to a voltage source through a resistor, and connect the output pin to a load resistor. The recommended bias voltage is between 2.5V and 5.5V, and the recommended input current is between 1mA and 10mA.
  • The maximum operating temperature range for the DMN2050LFDB-13 is -40°C to 125°C. However, it's recommended to operate the device within the range of -20°C to 85°C for optimal performance and reliability.
  • To handle ESD protection, it's recommended to use a TVS diode or a transient voltage suppressor in parallel with the DMN2050LFDB-13. This will help protect the device from electrostatic discharge and voltage transients.
  • The recommended storage temperature range for the DMN2050LFDB-13 is -40°C to 150°C. It's recommended to store the device in a dry, cool place, away from direct sunlight and moisture.

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DMN2050LFDB-13 Overview

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