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DMN3015LSD-13 - Diodes Incorporated

Description: MOSFET Dual N-Ch Enh FET 30Vdss 20Vgss 80A

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DMN3015LSD-13 Details

  • Manufacturer Part Number:

    DMN3015LSD-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SO-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    25 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    8.4 A

  • Drain-source On Resistance-Max:

    0.015 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN3015LSD-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMN3015LSD-13 is a 1.6mm x 1.6mm pad with a 0.5mm x 0.5mm thermal pad in the center, and a 0.3mm x 0.3mm pad for the drain pin.
  • To ensure proper thermal management, a thermal pad or heat sink should be used to dissipate heat. The thermal pad should be connected to a copper plane on the PCB to maximize heat dissipation.
  • The maximum operating temperature range for the DMN3015LSD-13 is -55°C to 150°C, but the recommended operating temperature range is -40°C to 125°C for optimal performance and reliability.
  • Yes, the DMN3015LSD-13 can be used in high-frequency applications up to 1 GHz, but the user should ensure that the PCB layout and component selection are optimized for high-frequency operation.
  • Yes, the DMN3015LSD-13 is compatible with lead-free soldering processes, and it meets the requirements of the RoHS directive.

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DMN3015LSD-13 Overview

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