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DMN3016LFDF-7 - Diodes Incorporated

Description: MOSFET MOSFET BVDSS: 25V 30V U-DFN2020-6 T&R 3K.

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DMN3016LFDF-7 - Diodes Incorporated - PCB symbol
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DMN3016LFDF-7 - Diodes Incorporated PCB footprint - Other - Other - DMN3016LFDF-7-2
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DMN3016LFDF-7 - Diodes Incorporated - 3D model - Other - DMN3016LFDF-7-2
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DMN3016LFDF-7 Details

  • Manufacturer Part Number:

    DMN3016LFDF-7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    U-DFN2020-6, 6 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    10 A

  • Drain-source On Resistance-Max:

    0.012 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN3016LFDF-7 Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for DMN3016LFDF-7 can be found in the Diodes Incorporated's application note AN-111, which provides guidelines for PCB layout and assembly.
  • To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal interface material to reduce the junction temperature.
  • The maximum allowable power dissipation for DMN3016LFDF-7 is dependent on the ambient temperature and the thermal resistance of the device. Refer to the thermal characteristics section in the datasheet for more information.
  • Yes, DMN3016LFDF-7 can be used in switching regulator applications. However, it is recommended to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range.
  • To protect the DMN3016LFDF-7 from ESD, it is recommended to follow proper handling and storage procedures, and to use ESD protection devices such as TVS diodes or ESD suppressors in the circuit design.

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DMN3016LFDF-7 Overview

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