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DMN3020UTS-13 - Diodes Incorporated

Description: DMN3020UTS-13 N-Channel MOSFET, 12 (State) A, 15 (Steady) A, 30 V, 8-Pin TSSOP Diodes Inc

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DMN3020UTS-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-8
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3D Models
DMN3020UTS-13 - Diodes Incorporated  - 3D model - Small Outline Packages - TSSOP-8
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DMN3020UTS-13 Details

  • Manufacturer Part Number:

    DMN3020UTS-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    19 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    6.8 A

  • Drain-source On Resistance-Max:

    0.02 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    80 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.4 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN3020UTS-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMN3020UTS-13 is a 3x3mm pad with a 1.5mm hole in the center, and a 0.5mm keep-out area around the pad.
  • To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a solder paste with a melting point of 217°C to 221°C. Avoid applying excessive force or heat, and ensure the component is properly aligned with the PCB pads.
  • The maximum operating temperature range for the DMN3020UTS-13 is -55°C to 150°C, with a storage temperature range of -55°C to 175°C.
  • Yes, the DMN3020UTS-13 is compatible with lead-free soldering processes, and is RoHS compliant.
  • The typical turn-on time for the DMN3020UTS-13 is around 10ns to 20ns, depending on the specific application and operating conditions.

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DMN3020UTS-13 Overview

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