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DMN3030LSS-13 - Diodes Incorporated

Description: MOSFET NMOS SINGLE N-CHANNL 30V 9A

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DMN3030LSS-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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DMN3030LSS-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8
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DMN3030LSS-13 Details

  • Manufacturer Part Number:

    DMN3030LSS-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    9 A

  • Drain-source On Resistance-Max:

    0.018 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    95 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN3030LSS-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMN3030LSS-13 is a 3x3mm pad with a 1.5mm diameter thermal pad in the center, and a 0.5mm gap between the pad and the thermal pad.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the device.
  • The maximum operating temperature range for the DMN3030LSS-13 is -55°C to 150°C, but the device is typically specified for operation from -40°C to 125°C.
  • Yes, the DMN3030LSS-13 is suitable for high-reliability applications, but it's essential to follow proper design, manufacturing, and testing procedures to ensure the device meets the required reliability standards.
  • Store the DMN3030LSS-13 in its original packaging or an equivalent ESD-protective package, and avoid exposing the device to moisture, extreme temperatures, or physical stress during shipping and storage.

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DMN3030LSS-13 Overview

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