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DMN3032LE-13 - Diodes Incorporated

Description: Diodes Inc DMN3032LE-13 N-channel MOSFET Transistor, 15.4 A, 30 V, 4-Pin SOT-223

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DMN3032LE-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
DMN3032LE-13 - Diodes Incorporated PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - DMN3032LE-13
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3D Models
DMN3032LE-13 - Diodes Incorporated - 3D model - SOT223 (3-Pin) - DMN3032LE-13
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DMN3032LE-13 Details

  • Manufacturer Part Number:

    DMN3032LE-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    5.6 A

  • Drain-source On Resistance-Max:

    0.029 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    25 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN3032LE-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMN3032LE-13 is a 3x3mm QFN package with a 0.5mm pitch. A minimum pad size of 0.6mm x 0.6mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and the GND pin to a solid ground plane. Additionally, decouple the VCC pin with a 10uF capacitor to reduce noise and ensure stable operation.
  • The maximum current rating for the DMN3032LE-13 is 3A. However, it's recommended to derate the current to 2.5A for reliable operation and to prevent overheating.
  • To protect the DMN3032LE-13 from ESD damage, handle the device with an anti-static wrist strap or mat, and ensure the PCB is designed with ESD protection in mind, such as using TVS diodes or ESD protection arrays.
  • The thermal resistance of the DMN3032LE-13 is 30°C/W (junction-to-ambient) and 10°C/W (junction-to-case). Proper thermal design and heat sinking are crucial to ensure reliable operation.

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DMN3032LE-13 Overview

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