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DMN3032LFDBQ-7 - Diodes Incorporated

Description: MOSFET Dual N-Ch Enh FET 30V 20Vgss 1.0W

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PCB Footprints
DMN3032LFDBQ-7 - Diodes Incorporated PCB footprint - Other - Other - U-DFN2020-6_2025_1
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3D Models
DMN3032LFDBQ-7 - Diodes Incorporated  - 3D model - Other - U-DFN2020-6_2025_1
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DMN3032LFDBQ-7 Details

  • Manufacturer Part Number:

    DMN3032LFDBQ-7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    10 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    6.2 A

  • Drain-source On Resistance-Max:

    0.03 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    44 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.7 W

  • Pulsed Drain Current-Max (IDM):

    25 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN3032LFDBQ-7 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the DMN3032LFDBQ-7 can be found in the Diodes Incorporated's package outline drawing, which is available on their website. It's essential to follow the recommended land pattern to ensure proper soldering and to prevent thermal issues.
  • To handle thermal management, ensure good thermal conductivity between the device and the PCB. Use thermal vias, thermal pads, and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow around the device.
  • The maximum operating temperature range for the DMN3032LFDBQ-7 is -55°C to 150°C. However, the recommended operating temperature range is -40°C to 125°C for optimal performance and reliability.
  • Yes, the DMN3032LFDBQ-7 is suitable for high-reliability applications. It's built with a robust design and undergoes rigorous testing to ensure its reliability. However, it's essential to follow proper design and manufacturing guidelines to ensure the device operates within its specified parameters.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines. Use a solder with a melting point below 260°C, and avoid overheating the device. Also, ensure the PCB is clean and free of contaminants before soldering.

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DMN3032LFDBQ-7 Overview

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