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DMN32D4SDW-7 - Diodes Incorporated

Description: Mosfet Array 30V 650mA 290mW Surface Mount SOT-363

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DMN32D4SDW-7 - Diodes Incorporated - PCB symbol
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PCB Footprints
DMN32D4SDW-7 - Diodes Incorporated PCB footprint - Other - Other - SOT-363
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3D Models
DMN32D4SDW-7 - Diodes Incorporated - 3D model - Other - SOT-363
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DMN32D4SDW-7 Details

  • Manufacturer Part Number:

    DMN32D4SDW-7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-363, 6 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.65 A

  • Drain-source On Resistance-Max:

    1 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    6.8 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.35 W

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN32D4SDW-7 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMN32D4SDW-7 is a SOIC-8 package with a 1.27mm pitch. The datasheet provides a recommended land pattern and solder mask layout.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and the GND pin to a solid ground plane. Additionally, decouple the power supply with a 10uF capacitor and a 100nF capacitor in parallel.
  • The DMN32D4SDW-7 can operate up to 100MHz, but the actual frequency limit depends on the specific application and PCB layout. It's recommended to consult the datasheet and application notes for more information.
  • To protect the DMN32D4SDW-7 from ESD and overvoltage, use a TVS diode or a transient voltage suppressor on the input pins, and ensure the PCB design includes adequate ESD protection measures.
  • The thermal resistance of the DMN32D4SDW-7 is typically 60°C/W (junction-to-ambient) and 10°C/W (junction-to-case). Proper thermal design and heat sinking are recommended to ensure reliable operation.

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DMN32D4SDW-7 Overview

Use the download button to access the DMN32D4SDW-7 schematic symbol, PCB footprint, and 3D model.
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