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DMN61D8LQ-13 - Diodes Incorporated

Description: MOSFET 60V Enh Mode FET 12Vgss 470mA 610mW

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DMN61D8LQ-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
DMN61D8LQ-13 - Diodes Incorporated PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - DMN61D8LQ-13
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3D Models
DMN61D8LQ-13 - Diodes Incorporated - 3D model - SOT23 (3-Pin) - DMN61D8LQ-13
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DMN61D8LQ-13 Details

  • Manufacturer Part Number:

    DMN61D8LQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G3

  • Length:

    2.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current Flow Direction:

    SINK

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Screening Level:

    AEC-Q101

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.915 mm

  • Terminal Position:

    DUAL

  • Width:

    1.3 mm

DMN61D8LQ-13 Frequently Asked Questions (FAQs)

  • The recommended land pattern for DMN61D8LQ-13 is a rectangle with a size of 1.6mm x 0.8mm, with a thermal pad size of 1.2mm x 0.8mm. The land pattern should be designed to accommodate the device's thermal characteristics and ensure good thermal conductivity.
  • To ensure the reliability of the DMN61D8LQ-13 in high-temperature applications, it is recommended to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good thermal conductivity between the device and the PCB. Additionally, consider using a heat sink or thermal management system to reduce the junction temperature.
  • The maximum allowable voltage for the DMN61D8LQ-13 is 20V. Exceeding this voltage may cause damage to the device or affect its reliability.
  • Yes, the DMN61D8LQ-13 can be used in switching regulator applications. However, it is essential to ensure that the device is operated within its recommended operating conditions and that the switching frequency is within the device's specified range.
  • During PCB assembly and rework, handle the DMN61D8LQ-13 by the body or the leads, avoiding touching the die or the thermal pad. Use anti-static precautions and follow the recommended soldering profile to prevent damage to the device.

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DMN61D8LQ-13 Overview

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