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DMN63D8LDWQ-7 - Diodes Incorporated

Description: MOSFET Dual N-Ch Enh FET 30Vdss 20Vdss 800mA

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PCB Footprints
DMN63D8LDWQ-7 - Diodes Incorporated PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT363
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3D Models
DMN63D8LDWQ-7 - Diodes Incorporated  - 3D model - SOT23 (6-Pin) - SOT363
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DMN63D8LDWQ-7 Details

  • Manufacturer Part Number:

    DMN63D8LDWQ-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOT-363, 6 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    3

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.22 A

  • Drain-source On Resistance-Max:

    4.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    2 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.4 W

  • Reference Standard:

    AEC-Q101; IATF 16949; MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN63D8LDWQ-7 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for DMN63D8LDWQ-7 is a QFN4040-24 package with a 4x4mm body size and 0.5mm pitch. The datasheet provides a recommended land pattern and solder mask design.
  • To ensure reliable operation of DMN63D8LDWQ-7 in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal vias, and ensuring good airflow around the device.
  • The maximum allowed voltage on the input pins of DMN63D8LDWQ-7 is 5.5V, as specified in the datasheet. Exceeding this voltage may cause damage to the device.
  • Yes, DMN63D8LDWQ-7 is compatible with 3.3V systems. The device is specified to operate from 2.3V to 5.5V, making it suitable for use in 3.3V systems.
  • To handle ESD protection for DMN63D8LDWQ-7, it is recommended to follow proper ESD handling procedures during assembly and testing, and to use ESD protection devices such as TVS diodes or ESD protection arrays on the input pins.

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DMN63D8LDWQ-7 Overview

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