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DMP3004SSS-13 - Diodes Incorporated

Description: P-Channel 30 V 16.2A (Ta) 1.2W (Ta) Surface Mount 8-SO

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DMP3004SSS-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
DMP3004SSS-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8_2024
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3D Models
DMP3004SSS-13 - Diodes Incorporated - 3D model - Small Outline Packages - SO-8_2024
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DMP3004SSS-13 Details

  • Manufacturer Part Number:

    DMP3004SSS-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2018-08-09

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    98 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    16.2 A

  • Drain-source On Resistance-Max:

    0.004 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    966 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Pulsed Drain Current-Max (IDM):

    110 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMP3004SSS-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for the DMP3004SSS-13 should minimize parasitic inductance and capacitance. Keep the input and output traces short and wide, and use a solid ground plane to reduce noise. A 4-layer PCB with a dedicated power plane and a separate ground plane is recommended.
  • The DMP3004SSS-13 has a thermal pad on the bottom of the package. Ensure good thermal contact between the pad and the PCB by applying a thermal interface material (TIM) such as thermal paste or thermal tape. A copper heat sink or a thermal via can also be used to dissipate heat.
  • The DMP3004SSS-13 has an operating temperature range of -55°C to 150°C. However, the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper thermal management to prevent overheating and reduce the risk of device failure.
  • Yes, the DMP3004SSS-13 is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101 and is qualified for automotive use. However, ensure that the device is used within its specified operating conditions and that proper design and testing procedures are followed.
  • The DMP3004SSS-13 is sensitive to electrostatic discharge (ESD). Handle the device with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the PCB and assembly process are also ESD-protected to prevent damage during handling and assembly.

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DMP3004SSS-13 Overview

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