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DMP3015LSS-13 - Diodes Incorporated

Description: DMP3015LSS-13 P-Channel MOSFET, 9.7 A, 30 V, 8-Pin SOP Diodes Inc

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DMP3015LSS-13 - Diodes Incorporated - PCB symbol
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DMP3015LSS-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - DMP3015LSS-13*
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DMP3015LSS-13 Details

  • Manufacturer Part Number:

    DMP3015LSS-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOT

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    3

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    13 A

  • Drain-source On Resistance-Max:

    0.011 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Pulsed Drain Current-Max (IDM):

    45 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMP3015LSS-13 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended to be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal pad.
  • The device requires a stable input voltage and a proper biasing circuit to ensure optimal performance. A voltage regulator or a voltage reference is recommended to provide a stable input voltage.
  • Handle the device in an ESD-controlled environment, wear an ESD strap, and use ESD-safe tools and materials to prevent damage. Avoid touching the device pins or exposing it to static electricity.
  • Yes, the DMP3015LSS-13 is suitable for high-reliability applications. However, it's essential to follow the recommended operating conditions, storage, and handling guidelines to ensure the device's reliability and longevity.
  • The optimal gate resistor value depends on the specific application requirements. A general guideline is to use a value between 10Ω to 100Ω. However, it's recommended to consult the application note or contact Diodes Incorporated's technical support for specific guidance.

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DMP3015LSS-13 Overview

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