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DMP3098L-7 - Diodes Incorporated

Description: P-Channel 30 V 3.8A (Ta) 1.08W (Ta) Surface Mount SOT-23-3

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PCB Footprints
DMP3098L-7 - Diodes Incorporated PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23----
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3D Models
DMP3098L-7 - Diodes Incorporated  - 3D model - SOT23 (3-Pin) - SOT-23----
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DMP3098L-7 Details

  • Manufacturer Part Number:

    DMP3098L-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    3.8 A

  • Drain-source On Resistance-Max:

    0.07 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    147 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.08 W

  • Pulsed Drain Current-Max (IDM):

    11 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    54.2 ns

  • Turn-on Time-Max (ton):

    22 ns

DMP3098L-7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the DMP3098L-7 should include a solid ground plane, wide copper traces for power and ground, and a thermal relief pattern under the device. A minimum of 2oz copper thickness is recommended. Refer to the Diodes Incorporated application note AN-114 for more details.
  • To ensure proper biasing, connect the gate to a voltage source through a 1kΩ to 10kΩ resistor. The gate voltage should be between 2V and 6V. A 100nF to 1μF capacitor between the gate and source can help reduce noise and oscillations.
  • Handle the device by the body or pins, avoiding touching the die. Store the device in an anti-static bag or wrap it in anti-static material. Avoid exposing the device to temperatures above 150°C or humidity above 80%.
  • Use the formula Pd = (Vds x Ids) + (Vgs x Igs) to calculate power dissipation. Then, use the thermal resistance (RθJA) from the datasheet to calculate the junction temperature (Tj) using the formula Tj = Tc + (Pd x RθJA), where Tc is the case temperature.
  • Use a soldering iron with a temperature of 250°C to 270°C. Apply solder for 2-3 seconds, and avoid applying excessive force or vibration. Use a solder with a melting point above 180°C.

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