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DMT10H025SSS-13 - Diodes Incorporated

Description: MOSFETs MOSFET BVDSS: 61V-100V

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DMT10H025SSS-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8...
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DMT10H025SSS-13 Details

  • Manufacturer Part Number:

    DMT10H025SSS-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SO-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    31.25 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    7.4 A

  • Drain-source On Resistance-Max:

    0.023 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    20.4 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    12.9 W

  • Pulsed Drain Current-Max (IDM):

    45 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMT10H025SSS-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMT10H025SSS-13 is a standard SOT23 package footprint with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the device.
  • The maximum operating temperature range for the DMT10H025SSS-13 is -40°C to 150°C, with a storage temperature range of -40°C to 150°C.
  • Yes, the DMT10H025SSS-13 is suitable for high-reliability applications, such as automotive, industrial, and medical devices, due to its high-quality manufacturing process and rigorous testing procedures.
  • Handle the DMT10H025SSS-13 by the body of the device, avoiding touching the leads or electrical contacts. Use an anti-static wrist strap or mat to prevent electrostatic discharge damage.

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DMT10H025SSS-13 Overview

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