DMT6030LFDF-7 footprint, schematic symbol and 3D model by Diodes Incorporated

Symbol

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PCB Footprints

DMT6030LFDF-7 - Diodes Incorporated PCB footprint - Other - Other - U-DFN2020-6 (Type F)_2024-5

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3D Models

DMT6030LFDF-7 - Diodes Incorporated - 3D model - Other - U-DFN2020-6 (Type F)_2024-5

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Datasheet Download Datasheet
Stock & Prices Price & Stock for DMT6030LFDF-7
Part Number DMT6030LFDF-7
Manufacturer Diodes Incorporated
Pin Count 8
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - U-DFN2020-6 (Type F)_2024-5
Released Date Nov 19, 2024
Last Modified Date Nov 19, 2024 5:13 AM UTC
Pinout / Pin List Click Here (Member Only)

DMT6030LFDF-7 Details

Manufacturer Part Number:
DMT6030LFDF-7
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
U-DFN2020-6
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.29.00.95
Factory Lead Time:
24 Weeks
Date Of Intro:
2019-05-24
Manufacturer:
Diodes Incorporated
YTEOL:
7
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
60 V
Drain Current-Max (ID):
6.8 A
Drain-source On Resistance-Max:
0.0255 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
639 pF
JESD-30 Code:
S-PDSO-N6
JESD-609 Code:
e4
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
6
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
SQUARE
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation Ambient-Max:
1.76 W
Power Dissipation-Max (Abs):
9.62 W
Surface Mount:
YES
Terminal Finish:
NICKEL PALLADIUM GOLD
Terminal Form:
NO LEAD
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

DMT6030LFDF-7 Frequently Asked Questions (FAQs)

Diodes Incorporated recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it is recommended to derate the device's current handling capability according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below the maximum rated value.
Diodes Incorporated recommends a soldering profile with a peak temperature of 260°C for a maximum of 10 seconds. The device should be soldered using a solder with a melting point of 220°C or higher.
Yes, the DMT6030LFDF-7 is qualified to AEC-Q101 standards, making it suitable for use in high-reliability and automotive applications. However, it is recommended to consult with Diodes Incorporated's application engineers to ensure the device meets the specific requirements of your application.
The DMT6030LFDF-7 has an integrated ESD protection diode, but it is still recommended to follow proper ESD handling procedures during assembly and testing to prevent damage to the device.

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DMT6030LFDF-7 Overview

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DMT6030LFDF-7 - Diodes Incorporated

DMT6030LFDF-7 Details

DMT6030LFDF-7 Frequently Asked Questions (FAQs)

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