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DMT67M8LSS-13 - Diodes Incorporated

Description: Transistor MOSFET N-Channel 60V 14.8A 8-Pin SO T/R

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DMT67M8LSS-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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DMT67M8LSS-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8
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DMT67M8LSS-13 Details

  • Manufacturer Part Number:

    DMT67M8LSS-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    84.5 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    12 A

  • Drain-source On Resistance-Max:

    0.0066 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    70 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.2 W

  • Pulsed Drain Current-Max (IDM):

    120 A

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMT67M8LSS-13 Frequently Asked Questions (FAQs)

  • Diodes Incorporated recommends a PCB layout with a solid ground plane, thermal vias, and a heat sink to ensure optimal thermal performance. A minimum of 2oz copper thickness is recommended for the PCB.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (up to 150°C) and consider derating the device's power dissipation. Additionally, ensure proper thermal management, such as using a heat sink, and follow the recommended PCB layout guidelines.
  • The DMT67M8LSS-13 has built-in ESD protection, but it's still essential to follow standard ESD handling precautions, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging. Avoid touching the device's pins or handling it in a way that could generate static electricity.
  • Yes, the DMT67M8LSS-13 is suitable for high-reliability and automotive applications. It meets the AEC-Q101 qualification standard for automotive-grade devices, and its robust design and manufacturing process ensure high reliability and long-term stability.
  • Diodes Incorporated recommends following the JEDEC J-STD-020D.01 standard for soldering conditions, which specifies a peak temperature of 260°C and a dwell time of 30 seconds. Ensure proper soldering techniques and avoid overheating the device.

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DMT67M8LSS-13 Overview

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