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DMTH10H017LPD-13 - Diodes Incorporated

Description: MOSFET MOSFET BVDSS: 61V-100V PowerDI5060-8 T&R 2.5K

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PCB Footprints
DMTH10H017LPD-13 - Diodes Incorporated PCB footprint - Other - Other - PowerDI® 5060-8 (Type E)
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3D Models
DMTH10H017LPD-13 - Diodes Incorporated  - 3D model - Other - PowerDI® 5060-8 (Type E)
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DMTH10H017LPD-13 Details

  • Manufacturer Part Number:

    DMTH10H017LPD-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    50 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    59 A

  • Drain-source On Resistance-Max:

    17.4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    20 pF

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    2.6 W

  • Power Dissipation-Max (Abs):

    93 W

  • Pulsed Drain Current-Max (IDM):

    236 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMTH10H017LPD-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMTH10H017LPD-13 is a 2x2 array of 0.5mm diameter pads with a 1.3mm pitch, as shown in the Diodes Incorporated application note AN-114.
  • To ensure reliable operation of the DMTH10H017LPD-13 in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal vias, and ensuring good airflow around the device.
  • The maximum allowable voltage for the DMTH10H017LPD-13 is 30V, as specified in the datasheet. Exceeding this voltage may result in device damage or failure.
  • To handle ESD protection for the DMTH10H017LPD-13, it is recommended to follow proper ESD handling procedures, including using ESD-safe materials and equipment, and ensuring that the device is properly grounded during handling and assembly.
  • The typical turn-on time for the DMTH10H017LPD-13 is around 10-20ns, depending on the specific application and operating conditions.

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