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DMTH6004SCTB-13 - Diodes Incorporated

Description: N-Channel 60 V 100A (Tc) 4.7W (Ta), 136W (Tc) Surface Mount TO-263 MOSFET N-CH 60V 100A TO263AB

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DMTH6004SCTB-13 - Diodes Incorporated PCB footprint - Other - Other - DMTH6004SCTB-13
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DMTH6004SCTB-13 Details

  • Manufacturer Part Number:

    DMTH6004SCTB-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    D2PAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    200 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.0034 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    105.2 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    136 W

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMTH6004SCTB-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMTH6004SCTB-13 is a 1.6mm x 1.2mm pad with a 0.5mm hole in the center for thermal vias. A larger pad size may be required for high-current applications.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the risk of overheating the device.
  • The DMTH6004SCTB-13 is rated for operation from -55°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
  • While the DMTH6004SCTB-13 is not hermetically sealed, it can operate in humid environments. However, it's recommended to apply a conformal coating to protect the device from moisture and corrosion.
  • Store the DMTH6004SCTB-13 in a dry, cool place with a relative humidity of 60% or less. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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DMTH6004SCTB-13 Overview

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