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DMTH61M8SPSQ-13 - Diodes Incorporated

Description: MOSFET MOSFET BVDSS: 41V-60V PowerDI5060-8 T&R 2.5K

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DMTH61M8SPSQ-13 - Diodes Incorporated PCB footprint - Other - Other - DMTH61M8SPSQ-13
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DMTH61M8SPSQ-13 Details

  • Manufacturer Part Number:

    DMTH61M8SPSQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    640.8 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    215 A

  • Drain-source On Resistance-Max:

    0.0016 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    184 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    167 W

  • Pulsed Drain Current-Max (IDM):

    860 A

  • Reference Standard:

    AEC-Q101; IATF 16949; MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMTH61M8SPSQ-13 Frequently Asked Questions (FAQs)

  • Diodes Incorporated recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the PCB.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (up to 150°C) and consider derating the device's power dissipation. Additionally, ensure good thermal management, such as using a heat sink or thermal interface material.
  • Diodes Incorporated recommends a soldering profile with a peak temperature of 260°C (max) and a dwell time of 10-30 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.
  • Yes, the DMTH61M8SPSQ-13 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is manufactured using a robust process to ensure high reliability.
  • To prevent ESD damage, handle the device with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the device is stored in an ESD-protected environment, and follow proper assembly procedures to prevent ESD damage.

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DMTH61M8SPSQ-13 Overview

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