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DN2540N3-G-P003 - Microchip

Description: MOSFET N-Channel MOSFET 400V 0.12A 3P TO-92

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DN2540N3-G-P003 - Microchip PCB footprint - Other - Other - TO-92 (N3)
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DN2540N3-G-P003 - Microchip  - 3D model - Other - TO-92 (N3)
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DN2540N3-G-P003 Details

  • Manufacturer Part Number:

    DN2540N3-G-P003

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Drain Current-Max (ID):

    0.12 A

  • Drain-source On Resistance-Max:

    25 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DN2540N3-G-P003 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow the PCB layout guidelines provided in the datasheet, ensuring a solid ground plane, and using thermal vias to dissipate heat. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended. Additionally, consider using thermal interface materials and heat sinks to manage temperature.
  • To ensure EMC and reduce EMI, follow the recommended PCB layout, use a shielded enclosure, and implement proper grounding and shielding techniques. Additionally, consider using EMI filters, ferrite beads, and shielding components to minimize radiation and susceptibility.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) first, followed by the input voltage (VIN). For power-down, reverse the sequence. Ensure that the power supply voltage is stable before applying the input voltage. Refer to the datasheet for specific timing requirements.
  • Use a logic analyzer or oscilloscope to monitor the device's signals and verify that the input and output signals meet the datasheet specifications. Check the power supply voltage, input voltage, and output voltage for any anomalies. Consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.
  • The device has a maximum junction temperature (TJ) of 150°C. Derate the power dissipation by 2.5mW/°C above 25°C. Ensure proper thermal management, such as using heat sinks and thermal interface materials, to maintain a safe operating temperature.

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DN2540N3-G-P003 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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