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DN2540N8-G - Microchip

Description: N-Channel Depletion-Mode Vertical DMOS FET 400V 25Ohm

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DN2540N8-G Details

  • Manufacturer Part Number:

    DN2540N8-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-89-3

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    400 V

  • Drain Current-Max (ID):

    0.17 A

  • Drain-source On Resistance-Max:

    25 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JEDEC-95 Code:

    TO-243AA

  • JESD-30 Code:

    R-PSSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Pulsed Drain Current-Max (IDM):

    0.5 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    35 ns

  • Turn-on Time-Max (ton):

    25 ns

DN2540N8-G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust power-on reset circuit, ensure a stable clock source, and use a reliable voltage regulator. Also, consider using a thermistor or thermocouple to monitor temperature and adjust system operation accordingly.
  • Use a combination of ceramic and electrolytic capacitors for decoupling, with a minimum of 10uF capacitance per power pin. Place decoupling capacitors as close to the power pins as possible, and use a single-point grounding scheme.
  • Use a high-quality clock source, such as a crystal oscillator or a low-jitter clock generator. Implement a clock tree with minimal routing layers, and use a clock buffer or repeater to reduce skew and jitter.
  • Use a shielded enclosure, and ensure a solid ground plane on the PCB. Implement EMI filters on I/O lines, and use a common-mode choke or ferrite bead on the power lines. Also, consider using a spread-spectrum clock generator to reduce EMI emissions.

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DN2540N8-G Overview

Use the download button to access the DN2540N8-G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like DN254, or try a keyword search, such as Power Field-Effect Transistors

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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