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DP83822HFRHBR - Texas Instruments

Description: Robust, Low Power 10/100 Ethernet Physical Layer Transceiver Extended Temperature With Fiber Support

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Symbol
DP83822HFRHBR - Texas Instruments - PCB symbol
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PCB Footprints
DP83822HFRHBR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RHB0032B
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3D Models
DP83822HFRHBR - Texas Instruments - 3D model - Quad Flat No-Lead - RHB0032B
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DP83822HFRHBR Details

  • Manufacturer Part Number:

    DP83822HFRHBR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2016-07-13

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Rate:

    100000 Mbps

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Transceivers:

    4

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

DP83822HFRHBR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DP83822HFRHBR evaluation module (EVM) user's guide, which includes guidelines for component placement, routing, and thermal management.
  • The DP83822HFRHBR can be configured using the SPI or I2C interface. Texas Instruments provides a software development kit (SDK) and application notes that provide examples of how to configure the device for specific Ethernet applications.
  • The DP83822HFRHBR has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. The device also has a thermal shutdown feature that can be enabled to prevent overheating.
  • Texas Instruments provides a troubleshooting guide in the DP83822HFRHBR datasheet and application notes that provide guidance on how to identify and resolve common issues, such as link faults, packet loss, and PHY register configuration errors.
  • The DP83822HFRHBR has multiple power management modes, including a low-power mode that can be enabled to reduce power consumption. The device also has a wake-on-LAN (WOL) feature that allows it to wake up from a low-power state in response to a network packet.

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DP83822HFRHBR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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