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DRA3115T0L - Panasonic

Description: DRA3115T0L, Digital Transistor, PNP -100 mA -50 V Ratio Of 100 kΩ, 3-Pin SSSMini3 F2 B

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PCB Footprints
DRA3115T0L - Panasonic PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SSSMini3-F2-B
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3D Models
DRA3115T0L - Panasonic  - 3D model - SO Transistor Flat Lead - SSSMini3-F2-B
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DRA3115T0L Details

  • Manufacturer Part Number:

    DRA3115T0L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, SSSMINI3-F2-B, SC-105AA, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Panasonic Electronic Components

  • Additional Feature:

    BUILT IN BIAS RESISTOR

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    160

  • JESD-30 Code:

    R-PDSO-F3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    PNP

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DRA3115T0L Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and radiation.
  • Implement thermal management techniques such as heat sinks, thermal vias, and thermal interface materials. Ensure good airflow and avoid blocking airflow around the component.
  • While the datasheet specifies a maximum frequency of 100 MHz, some users have reported successful operation up to 200 MHz. However, this may require careful PCB design and signal integrity analysis.
  • The POR and BOD features can be controlled through external resistors and capacitors. Consult the datasheet and application notes for specific guidance on implementing these features.
  • Use 0.1 μF to 1 μF decoupling capacitors placed as close as possible to the power pins. Additional capacitors may be required depending on the specific application and PCB layout.

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DRA3115T0L Overview

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