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DRA3144T0L - Panasonic

Description: DRA3144T0L, Digital Transistor, PNP -100 mA -50 V Ratio Of 47 kΩ, 3-Pin SSSMini3 F2 B

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PCB Footprints
DRA3144T0L - Panasonic PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SSSMini3-F2-B
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3D Models
DRA3144T0L - Panasonic  - 3D model - SO Transistor Flat Lead - SSSMini3-F2-B
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DRA3144T0L Details

  • Manufacturer Part Number:

    DRA3144T0L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, SSSMINI3-F2-B, SC-105AA, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Panasonic Electronic Components

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    160

  • JESD-30 Code:

    R-PDSO-F3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    PNP

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DRA3144T0L Frequently Asked Questions (FAQs)

  • Panasonic recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • To ensure reliable operation, follow the recommended operating temperature range (up to 125°C), use a heat sink if necessary, and consider derating the power dissipation according to the temperature derating curve.
  • Although not explicitly stated in the datasheet, it's recommended to limit the input voltage to the maximum rating of the device (VCC + 0.3V) to prevent damage or latch-up.
  • Yes, the DRA3144T0L can be used in switching regulator applications, but ensure that the device is properly bypassed and decoupled to minimize noise and voltage spikes.
  • Follow proper ESD handling procedures during assembly and storage, and consider adding external ESD protection devices (e.g., TVS diodes) to the PCB design if necessary.

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DRA3144T0L Overview

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